Thermosetting resin composition and prepreg
US11639439B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Aug 25, 2021 |
| Grant date | May 2, 2023 |
| Priority date | — |
| Expiry date | Dec 24, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2312/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):in Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.