Adhesive for joining metals and resins, its adhesive layer and application thereof
US11639454B2 · kind B2 · utility
0Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2020 |
| Grant date | May 2, 2023 |
| Priority date | — |
| Expiry date | Aug 11, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2203/326
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive for joining metals and resins is disclosed. The adhesive comprises 0.0001˜3 wt. % of amino silane, 0.0001˜1 wt. % of a crosslinker and 0.0001˜3 wt. % of an organometallic compound. In particular, the adhesive forms an adhesive layer that has a metal atomic ratio less than 50%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.