Optical phased array chip using MEMS switch and manufacturing method thereof
US11640030B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 14, 2022 |
| Grant date | May 2, 2023 |
| Priority date | — |
| Expiry date | Jan 14, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/1215
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.