Patent · US Active

Connecting thermally-sprayed layer structures of heating devices

US11641698B2 · kind B2 · utility

0Cited by

14References

17Claims

0Family size

Assignee

BSH Hausgeräte GmbH · DE

Inventors

Stefan Kobler · Neuendorf, CH
Robert Kühn · Nümbrecht, DE
Philipp Schaller · Stein am Rhein, CH

Key dates

Filing date	Jul 1, 2016
Grant date	May 2, 2023
Priority date	—
Expiry date	Jun 29, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05B2203/017
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A heating device for a domestic appliance includes a planar carrier having a carrier surface. Thermally sprayed onto the carrier surface is a layer structure, and a first solder volume is applied to the layer structure. The solder volume is an ultrasonically soldered-on solder volume. The layer structure can hereby be a heating conductor layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.