Manufacturing method of printed circuit board
US11641719B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2020 |
| Grant date | May 2, 2023 |
| Priority date | — |
| Expiry date | Feb 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a medium layer. The core plates may be cut-out and form the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.