Plasma cleaning apparatus and semiconductor process equipment with the same
US11643722B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2020 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Jun 17, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02C20/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma cleaning apparatus includes a metal chamber, a gate assembly, a dielectric, and a high voltage electrode.The metal chamber is connected to a vacuum tube connecting the process chamber and the vacuum pump, and is provided with a first opening. The gate assembly includes a gate support fixed to the metal chamber around the first opening and having a second opening, and a gate coupled to the gate support and having a first position closing the second opening and a second position opening the second opening switchable with each other. The dielectric is coupled to the outside of the gate support around the second opening, and the high voltage electrode is positioned on an outer surface of the dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.