Temperature-control unit for a furnace device for heat treating a plate
US11644240B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2018 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Nov 28, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to a temperature-control unit for a furnace device for heat treating a plate, in particular a metal plate. The temperature-control unit has a temperature-control body, which is arrangeable in a furnace chamber of the furnace device. The temperature-control body has a plurality of receiving bores. Furthermore, the temperature-control unit has a plurality of temperature-control pins, wherein the temperature-control pins are mounted in the receiving bores movably relative to the temperature-control body. The temperature-control pins are controllable in such a way that a temperature-control group of the temperature-control pins is extendable from the temperature-control body in the direction towards the plate, so that a thermal contact between the temperature-control group of the temperature-control pins and a predetermined temperature-control zone of the plate is generatable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.