Thermal transfer device having a fluid conduit
US11644254B2 · kind B2 · utility
1Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2021 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Mar 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20254
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal transfer device has a body and a fluid conduit defined in the body. The body has a thermal transfer surface configured to be placed in contact with a target component. The fluid conduit is configured for conveying fluid through the body and is thermally coupled to the thermal transfer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.