Temperature insensitive distributed strain monitoring apparatus and method
US11644305B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2021 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Sep 26, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12164
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus for monitoring strain in an optical chip in silicon photonics platform. The apparatus includes a silicon photonics substrate shared with the optical chip. Additionally, the apparatus includes an optical input configured in the silicon photonics substrate to supply an input signal of a single wavelength. The apparatus further includes a first waveguide arm and a second waveguide arm embedded in the silicon photonics substrate to form an on-chip interferometer. The second waveguide arm forms a delay line being disposed at a region in or adjacent to the optical chip. The on-chip interferometer is configured to generate an interference pattern serving as an indicator of strain distributed at the region in or adjacent to the optical chip. The interference pattern is caused by a temperature-independent phase shift at the single wavelength of the interferometer between the first waveguide arm and the second waveguide arm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.