Current sensor integrated circuits
US11644485B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2021 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Dec 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49171
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A current sensor integrated circuit configured to sense a current through a current conductor includes a lead frame at least one signal lead, a fan out wafer level package (FOWLP), and a mold material enclosing the FOWLP and a portion of the lead frame. The FOWLP includes a semiconductor die configured to support at least one magnetic field sensing element to sense a magnetic field associated with the current, wherein the semiconductor die has a first surface on which at least one connection pad is accessible, a redistribution layer in contact with the at least one connection pad, and an insulating layer in contact with the redistribution layer, wherein the insulating layer is configured to extend beyond a periphery of the semiconductor die by a minimum distance. The die connection pad is configured to be electrically coupled to the at least one signal lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.