Stealth dicing method including filamentation and apparatus thereof

US11646228B2 · kind B2 · utility

Assignees

• CHONGQING INSTITUTE OF EAST CHINA NORMAL UNIVERSITY · CN
• EAST CHINA NORMAL UNIVERSITY · CN
• University of Shanghai for Science and Technology · CN

Inventors

• Heping Zeng · Chongqing, CN
• Shuai Yuan · Chongqing, CN
• Yingsheng Du · Chongqing, CN
• Hui Xu · Lo Wu, CN
• Yuan Nie · Hanover, US
• Yong Wang · Lo Wu, CN
• Jin WANG · Zhunan, TW
• Jue-Chin Yu · Taichung, TW
• Yanying Ma · Chongqing, CN

Key dates

• Filing date: Jul 13, 2020
• Grant date: May 9, 2023
• Expiry date: Aug 25, 2041

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K2103/56
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The present disclosure provides a stealth dicing method and apparatus. With the method, the focusing element focuses the laser beam on the surface of material to be diced, and the dynamic-equilibrium plasma channel is formed in the material to be diced by means of self-focusing and defocusing effect of plasma generated by ionizing the material to be diced. The modified layer may be formed in the material to be diced throughout the plasma channel, so as to realize stealth dicing.