Image pickup apparatus equipped with heat dissipation mechanism
US11647268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2021 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | May 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image pickup apparatus that can efficiently solve problems caused by heat generated by a heat generating element. The image pickup apparatus including a sensor substrate configured to implement an image sensor, and a main circuit board configured to implement a heat generating element. A length of the main circuit board is longer than a length of the sensor substrate in a width direction of the image pickup apparatus. The main circuit board is aslant arranged to an optical axis of the image pickup apparatus so that a first space part will be provided between the sensor substrate and the main circuit board. A cross section of the first space part in a plane that is parallel to both the optical axis and the width direction is approximately triangle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.