Sealed package and method of forming same

US11647600B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• Christian S. Nielsen · River Falls, US
• Rajesh V. Iyer · Eden Prairie, US
• Gordon O. Munns · Stacy, US
• Andrew J. Ries · Lino Lakes, US
• Andrew J. Thom · Maple Grove, US

Key dates

• Filing date: Dec 29, 2020
• Grant date: May 9, 2023
• Expiry date: Jun 3, 2041

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E60/10
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.