Localized immersion cooling enclosure with thermal efficiency features
US11647607B2 · kind B2 · utility
1Cited by
21References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2021 |
| Grant date | May 9, 2023 |
| Priority date | — |
| Expiry date | Jul 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.