Apparatus to form and assemble a flexible cover on a carrier
US11648764B2 · kind B2 · utility
0Cited by
2References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 2, 2018 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Jan 5, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B23/0302
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure relates to a method for manufacturing a bent component. The present disclosure moreover relates to a shaping tool for manufacturing a bent component. The shaping tool comprises a first tool half, a second tool half and at least one movable cylinder pin. The first tool half of the shaping tool is arranged opposite the second half of the shaping tool. An outer end of the at least one cylinder pin herein points in the direction of the second half of the shaping tool. A holding element for receiving a flat bendable element is assembled on this outer end of the at least one cylinder pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.