Patent · US Active

Copper based microcrystalline alloy, preparation method thereof, and electronic product

US11649528B2 · kind B2 · utility

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0References

14Claims

0Family size

Assignee

BYD Company Limited · CN

Inventors

Qing Gong · Cary, US
Qiang Guo · Tangxia, CN
Mengde WANG · Austin, US
Wei An · Waltham, US

Key dates

Filing date	Dec 24, 2018
Grant date	May 16, 2023
Priority date	—
Expiry date	Dec 24, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH04M1/026
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.