Hybrid thermal cooling system
US11649993B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2019 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Aug 28, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2321/0251
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.