Cut pattern for film
US11650353B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2019 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Dec 27, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A cut pattern for a film or film laminate used in the fabrication of optical articles such as lenses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.