Thermal optimizations for OSFP optical transceiver modules
US11650384B2 · kind B2 · utility
11Cited by
50References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2022 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Feb 9, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4284
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.