Methods and systems for manufacturing printed circuit board based on x-ray inspection
US11651492B2 · kind B2 · utility
2Cited by
12References
78Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2020 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Jul 9, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.