Mounting supports that create a bond pad gap for a hard disk slider
US11651785B1 · kind B1 · utility
0Cited by
21References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 25, 2022 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Apr 25, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/1278
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods are described for forming a mounting surface on a slider body. In one method, an adhesion layer can be deposited on a top surface of a slider body. A first photolithography cycle deposits a first metal layer having a first thickness of at least 8 μm. A second photolithography cycle deposits a second metal layer having a second thickness of at least 8 μm over the first metal layer. The first and second layer form a mounting support on the top surface. In another method, the top surface is etched to form a mounting support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.