Three-dimensional printed feedthroughs for implantable medical devices
US11651873B2 · kind B2 · utility
0Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2022 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Jun 24, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ceramic subassembly manufactured by a 3D-printing process is described. The ceramic subassembly comprises a ceramic substrate having a sidewall extending to spaced apart first and second end surfaces. At least one via extends through the substrate from the ceramic substrate first end surface to the ceramic substrate second end surface. In cross-section, the via has a square-shape with rounded corners.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.