Multilayer electronic component
US11651901B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2021 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Aug 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.