Semiconductor package and method of fabricating the same
US11651974B2 · kind B2 · utility
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1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2021 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Mar 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.