Power module having packaged power semiconductors for the controllable supply of electric power to a load
US11652021B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 6, 2020 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Jun 4, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module has a plurality of packaged power semiconductors, a printed circuit board, a heat sink, and possibly a sealing compound. The power semiconductors have electrically conductive connection elements and heat removal areas on respective outer sides. The power semiconductors are arranged on a cooling surface of the heat sink and has its heat removal area connected to the cooling surface of the heat sink to conduct heat, and the printed circuit board is arranged on a side of the power semiconductors that is opposite the heat sink in an orthogonal direction, wherein the connection elements of the power semiconductors make electrical contact with pads on the printed circuit board regions, for example, laterally beside an edge of the heat sink, in which a projection of the heat sink onto the printed circuit board in the orthogonal direction does not cover the connection elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.