Contact structure and electronic device having the same
US11652051B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2021 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Jul 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes: a substrate; a copper layer disposed on the substrate; an adhesion promotion layer disposed on the copper layer, wherein the adhesion promotion layer forms a monomolecular adsorption layer on the surface of the copper layer; and a silver nanowire layer disposed on the adhesion promotion layer, and the adhesive force between the copper layer and the silver nanowire layer is 3B or more. In the present disclosure, by disposing the adhesion promotion layer on the copper layer, in the stacked structure of the copper layer and the silver nanowire layer, the adhesive force between the copper layer and the silver nanowire layer is increased, so as to prevent a peeling phenomenon of the copper layer occurring in the subsequent yellow-light process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.