Event-based vision sensor manufactured with 3D-IC technology
US11652126B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jan 29, 2021 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Aug 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N25/51
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An event-based vision sensor is fabricated using an advanced stacking technique, known as Three-Dimensional Integrated Circuit, which stacks more wafers (or dies) and interconnects them vertically. The electronic integrated circuits of the sensor are then distributed between the two or more electrically connected dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.