Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module
US11653079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 25, 2017 |
| Grant date | May 16, 2023 |
| Priority date | — |
| Expiry date | Jul 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.