Polyimide precursor solution and method for producing same
US11655337B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2017 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Oct 18, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a polyimide precursor solution which can enhance the uniformity of a polyimide film and also improve the efficiency of processes by improving liquid curl in a coating process of the polyimide precursor solution. In addition, since polyimide according to the present invention has excellent transparency, heat resistance, mechanical strength and flexibility by comprising a specific structure, the polyimide may be used in various fields, such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, flexible printed circuits (FPCs), tapes, touch panels, protective films for optical discs, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.