Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same
US11655363B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2019 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Sep 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3862
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.