Printable curable mixtures and cured compositions
US11655403B2 · kind B2 · utility
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11References
11Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 27, 2018 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Nov 22, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2433/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A curable mixture, a partially cured composition, a cured composition, an article containing either the partially cured composition or the cured composition, and a method of bonding two substrates are provided. The partially cured composition functions as a pressure-sensitive adhesive while the cured composition functions as a structural or semi-structural adhesive. The curable mixture can be applied to a first substrate by printing or dispensing, if desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.