Pressure sensor assembly
US11656138B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2020 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | May 2, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/145
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor assembly includes a pressure sensor, a pedestal and an electrically conductive header having a header cavity. The pressure sensor includes, an electrically conductive sensing layer having a sensor diaphragm, an electrically conductive backing layer having a bottom surface that is bonded to the sensing layer, an electrically insulative layer having a bottom surface that is bonded to a top surface of the backing layer, and a sensor element having an electrical parameter that changes based on a deflection of the sensor diaphragm in response to a pressure difference. The pedestal is bonded to the electrically insulative layer and attached to the header within the header cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.