Wafer inspection system
US11656271B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2022 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Mar 21, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06727
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.