System, apparatus and method for dynamic thermal distribution of a system on chip
US11656676B2 · kind B2 · utility
0Cited by
27References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2018 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | May 29, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a processor includes: a first plurality of intellectual property (IP) circuits to execute operations; and a second plurality of integrated voltage regulators, where the second plurality of integrated voltage regulators are oversubscribed with respect to the first plurality of IP circuits. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.