Chip transferring method and the apparatus thereof
US11658052B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2021 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Jul 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68368
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic value of each of the plurality of chips; providing a second load-bearing structure; weakening a first adhesion between the first portion chips and the first load-bearing structure or between the second portion chips and the first load-bearing structure; and transferring the first portion chips or the second portion chips to the second load-bearing structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.