Semiconductor apparatus and semiconductor device
US11658081B2 · kind B2 · utility
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10Claims
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Assignee
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Key dates
| Filing date | May 21, 2021 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Jun 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes a mounting board, a system on chip (SOC) package and a memory package which are provided on the mounting board. The SOC package includes a semiconductor chip and a package substrate on which the semiconductor chip is mounted. The semiconductor apparatus further includes a signal wiring line through which a signal between the semiconductor chip and the memory package is transmitted, being provided on the package substrate and in the mounting board and a measurement terminal connected to the signal wiring line on main surface of the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.