Semiconductor device
US11658151B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 27, 2021 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Nov 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor unit, a printed circuit board and a case, including a bottom portion formed in a plate-like shape and a side wall portion surrounding an outer periphery of the bottom portion of the case. The bottom portion has a main circuit area having an opening, and a control circuit area adjacent to the main circuit area in a plan view. The semiconductor unit is attached in the main circuit area from a rear surface of the bottom portion such that an insulating plate of the semiconductor unit is exposed to inside the case through the opening. The printed circuit board is disposed in the control circuit area on the front surface of the bottom portion via a spacer, having a gap between the printed circuit board and the front surface of the bottom portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.