Method for manufacturing light emitting device
US11658262B1 · kind B1 · utility
1Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2020 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Aug 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a light emitting device is provided. The method for manufacturing the light emitting device includes: providing a substrate with light emitting units disposed thereon; attaching the light emitting units to a carrier; removing the substrate; and transferring a portion of the light emitting units from the carrier to a driving substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.