Packaging structure including a substrate having a coplanar waveguide, an air bridge and a superconducting material compensating structure formed thereon
US11658373B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2021 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Jun 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P11/003
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A packaging structure, a method of manufacturing a packaging structure, and a quantum processor include a substrate; a coplanar waveguide including a first ground wire, a second ground wire, and a signal wire, wherein the first ground wire, the second ground wire, and the signal wire are disposed on a surface of the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire; an air bridge including a first end connected with the first ground wire and a second end connected with the second ground wire, wherein a gap exists between the air bridge and a surface of the signal wire away from the substrate; and a compensation structure located on the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.