Edge interconnects for use with circuit boards and integrated circuits
US11658432B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2021 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Dec 9, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate assembly includes a printed circuit (PC) substrate, first and second microchips, components or substrates mounted on a surface of the PC substrate, and a projection extending in spaced relation to the surface of the PC substrate. In one example, the projection extends between (i) a downward facing surface and/or an edge of a side facing surface proximate the downward facing surface of the first microchip, component or substrate and (ii) an upward facing surface and/or an edge of a side facing surface proximate the upward facing surface of the first microchip, component or substrate. The first and second microchips, components or substrates may be mounted on different levels of the PC substrate surface. In another example, the projection extends between a upward and/or side facing surface of a first microchip, component or substrate and a slot or cavity in a second microchip, component or substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.