Electronic device
US11659664B2 · kind B2 · utility
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20Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 10, 2021 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Sep 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10757
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.