Multi-step integrated circuit handling process and apparatus
US11659669B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2018 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Oct 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One exemplary aspect relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations to facilitate shipping and subsequent removal of the flexible substrate from the carrier. The process includes providing a flexible substrate comprising a plurality of integrated circuits thereon providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier. The process further includes changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.