Deployable hardened housing units
US11659670B2 · kind B2 · utility
0Cited by
11References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2021 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | May 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/06
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application describes apparatuses, systems, and methods for robust, adaptable, and deployable computing devices and radio systems. In one aspect, the present application describes a chassis for housing electronic componentry. The chassis includes a frame with a top plate and a bottom plate, an interface panel located on the chassis frame; a back panel located on the chassis frame opposite the interface panel, and a protective protrusion located at a corner of the chassis frame extending beyond the top plate and the bottom plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.