Rack assembly for vertical airflow cooled devices
US11659692B2 · kind B2 · utility
0Cited by
20References
18Claims
0Family size
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Key dates
| Filing date | Dec 20, 2019 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Dec 20, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.