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US11659746B2 · kind B2 · utility

0Cited by
7References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 9, 2018
Grant dateMay 23, 2023
Priority date
Expiry dateJun 24, 2039

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/549
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A first wiring line and a second wiring line are extended to an upper face of a resin substrate exposed from a slit formed in at least one layer of an inorganic insulating film, a first flattening film is provided within the slit which exposes the upper face of the resin substrate between the portions to which the first wiring line and the second wiring line are extended, and the first wiring line and the second wiring line are electrically connected to each other via a third wiring line provided between an end face of the first flattening film and the upper face of the resin substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.