Package with built-in thermoelectric element
US11659767B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 14, 2018 |
| Grant date | May 23, 2023 |
| Priority date | — |
| Expiry date | Apr 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/82
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.