Molded hockey puck with electronic signal transmitter core
US11660515B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2022 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Aug 5, 2042 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA63B2225/74
- WIPO fieldFurniture, games
- WIPO sectorOther fields
Abstract
A hockey puck is formed as two mating subcomponents encapsulating an internal signal transmitter. The hockey puck includes holes extending from an external surface of the hockey puck into an internal void formed between the two mating subcomponents. The internal signal transmitter includes protrusions extending into the holes, each including a surface-mounted diode. The surface-mounted diodes include no lens cap, allowing the diodes to be positioned closer to the external surface of the puck than existing pucks. For improved visibility, the diode is positioned less than 5 mm from the external surface of the puck, but greater than 1 mm from the external surface of the puck, in order to prevent the diodes from being externally visible. Preferably, the diodes are positioned between approximately 2 mm and approximately 3 mm from the external surface of the hockey puck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.