Activating surfaces for subsequent bonding
US11661487B2 · kind B2 · utility
1Cited by
3References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Nov 22, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2381/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of activating a surface of a plastics substrate formed from: Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.