Adhesives for chemical mechanical planarization applications
US11661532B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Jun 7, 2016 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Aug 9, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.