Hot melt adhesive composition
US11661534B2 · kind B2 · utility
0Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2020 |
| Grant date | May 30, 2023 |
| Priority date | — |
| Expiry date | Jun 4, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J153/025
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention relates to a hot melt adhesive composition. The hot melt adhesive composition according to the present invention comprises at least one hydrogenated thermoplastic block copolymer with a melt index greater than or equal to 30 grams per 10 minutes at 190° C./2.16 kg; and at least one polyolefin with a melt viscosity less than or equal to 2000 cPs at 190° C. The hot melt adhesive composition according to the present invention can be applied at low temperature, has excellent T peel strength and low odor after being applied in the disposable products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.